Intel FUP4X35S3HSBP – 3.5 Inch H-S Backplane
The FUP4X35S3HSBP is a high-performance backplane designed to meet the demands of enterprise environments. This device features a 3.5-inch form factor, making it an ideal solution for applications where space is limited. The backplane’s architecture is designed to provide high-speed data transfer rates, making it suitable for use in high-performance computing and storage applications.
The backplane’s H-S configuration provides a high level of flexibility, allowing it to be used in a variety of applications. The device is also designed to be highly reliable, with features such as hot-swappable components and redundant power supplies.
In enterprise environments, the FUP4X35S3HSBP can be used to improve the performance and reliability of storage and computing systems. The device can be used to connect multiple storage devices, such as hard drives and solid-state drives, to a single system. This can help to improve data transfer rates and reduce the risk of data loss.
The backplane’s compact form factor also makes it an ideal solution for use in data centers and other applications where space is limited. The device can be used to connect multiple systems together, helping to improve the overall performance and efficiency of the data center.
Technical Specifications
| Brand | Intel |
| SKU | FUP4X35S3HSBP |
| Category | Components |
| Form Factor | 3.5 Inch |
| Configuration | H-S |
| Application | Enterprise Environments |
| View all Intel Products → | |
Challenges Solved by this Solution
s, IT professionals are under pressure to deliver high-performance systems that can meet the demands of their organizations. However, traditional storage and computing systems can be bottlenecked by slow data transfer rates and limited scalability.
The FUP4X35S3HSBP helps to solve these problems by providing a high-performance backplane that can improve data transfer rates and increase system scalability. The device’s compact form factor and hot-swappable components also make it an ideal solution for use in data centers and other applications where space is limited.
By deploying the FUP4X35S3HSBP, IT professionals can improve the overall performance and efficiency of their systems, reducing the risk of data loss and improving the reliability of their infrastructure. This can help to reduce IT overhead and improve the return on investment for their organizations.
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Frequently Asked Questions
What is the typical application for a 3.5-inch backplane?
A 3.5-inch backplane is typically used in enterprise environments, such as data centers and high-performance computing applications.
Can the FUP4X35S3HSBP be used in a data center?
Yes, the FUP4X35S3HSBP is designed to be used in data centers and other applications where space is limited.
How does the FUP4X35S3HSBP improve system performance?
The FUP4X35S3HSBP improves system performance by providing high-speed data transfer rates and increasing system scalability.
What kind of support does the TECHOM Systems Sales team offer for the FUP4X35S3HSBP?
The TECHOM Systems Sales team can provide support for the FUP4X35S3HSBP, including installation support, design services, and consulting services.
Ready to Deploy Intel – 3.5 Inch H-s Backplane (FUP4X35S3HSBP)?
Product Ref: TOS-1600736 • Get enterprise pricing, volume discounts, and Australian support.
